| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology devised to prevent the occurrence of the cutting/lifting pieces of resin burr at detaching of an island port from a package and to eliminate the problem of contact defects and a soldering defects in a post-process owing to the existence of the cutting/lifting pieces of resin burr. SOLUTION: A plurality of leads provided around a semiconductor element mounting part and an island support 10 connecting the semiconductor element mounting part and an outer frame 1 are provided. A region where resin burr 20-1 remains is set beyond the region of the island support 10 in a semiconductor lead frame, where resin burr 20-1 by the air bent groove 30-1 of a mold K at the time of forming resin sealing remains in a region, in which the semiconductor element mounting part and a plurality of leads are sealed by resin and which contains the island support 10.
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