| 摘要 |
PROBLEM TO BE SOLVED: To obtain an electronic component bonding apparatus and method which can stabilize bonding quality. SOLUTION: In this method for eutectically bonding a chip 8 onto a substrate 6 heated in an inert-gas atmosphere, nitrogen gas is supplied from a nitrogen gas blow-out port provided in the heat block 22 to surroundings of the substrate 6, while the substrate 6 is heated by a heat block 22 carrying the substrate 6. Then the heated nitrogen gas is supplied from a plurality of holes in a periphery of an opening 23a made in a cover member 23, provided to cover the heat block 22 and corresponding to an elevating position of a bonding tool 32 to the surroundings of the chip 8. Thereby a stable low-oxygen atmosphere can be provided to the surroundings of the chip 8 to be bonded, thus making a bonding quality stabilized.
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