| 摘要 |
PROBLEM TO BE SOLVED: To enable easy and quick mounting and dismounting of a tape pressing plate, even in the presence of a high-temperature bonding tool positioned adjacent to a clamp means or a means for transferring a chip from a wafer to a bonding position. SOLUTION: In order to gang bond a tape for TAB(tape automated bonding) and a chip, a clamping jig has a tape pressing plate for pressing the tape around a chip mounting position from above. A plate 16 is arranged to be removably mounted along the side edge of a window 12 made in a clamp base 10. That is, the plate 16 can be fixed to a slide frame 14 so that the frame 14 can be mounted along the base surface of the clamp base 10 removably therefrom.
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