| 摘要 |
PROBLEM TO BE SOLVED: To sufficiently spread ink without increasing the height of ink by absorbing a part of granular ink, destroying surface tension, reducing height, and more widely diffusing ink. SOLUTION: For giving a failure identification mark to a defective chip in the assembly of a thin mold package, ink is taken out from an inker 12, and a cloth or sponge-like blotting mechanism 13 attached to a position surrounding the inker 12 is brought into contact with ink as soon as or after ink is adhered to a chip 11 to which ink is adhered. A part of ink is absorbed and it is flattened. Namely, surface tension is destroyed while unnecessary ink is absorbed and removed. The height of ink is dissolved and an ink diameter can be diffused. The extent of ink in the failure identification mark of a wafer probe test is secured and low inking is realized.
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