| 摘要 |
PROBLEM TO BE SOLVED: To set the ground surface of a flip chip in a stable state to ensure desired circuit characteristics by conductivity connecting one surface of the flip chip to one surface of a substrate via conductive connecting members. SOLUTION: A ground surface 111 of an MMIC chip 101 is connected to a ground surface 106 of a substrate 103 via a conductive adhesive 8 of Ag paste, etc., and vias 2 formed through the substrate 103, such that the conductive adhesive 8 will not come contact into with a wiring pattern (50Ωmicrostrip line) 104 on the substrate 103 to avoid short-circuiting. Thus the ground surface 111 of the MMIC chip 101 will not float electrically but is surely grounded to the back side ground 106, so that deviation of the characteristics of the wiring pattern (circuit pattern) 104 due to the microstrip line on the MMIC chip 101 is avoided. |
