| 摘要 |
PROBLEM TO BE SOLVED: To enhance a transmission rate of a signal by reducing the mount area of a device even when pluralities of LSI chips are mounted on a printed circuit board of the device. SOLUTION: The LSI chip is provided with an LSI chip main body 10, pluralities of pads 11 provided on a front side of an outer circumference of the LSI chip main body 10, a communication control section 12 that is built in the LSI chip main body 10 to apply input output control to a signal, an inverted F transmission reception antenna 15 that is built in each of pluralities of the pads 11 and sends/receives an electromagnetic wave, and a radio transmission reception section 13 that is built in the LSI chip main body 10 and communicates a signal with the transmission reception antenna 15 of each pad and the communication control section 12.
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