| 摘要 |
PROBLEM TO BE SOLVED: To provide a board for printed wiring, which can obtain high adhesive strength of an epoxy resin to a copper foil. SOLUTION: A board A for printed wiring is formed by a method wherein a prepreg prepared by curing a base material impregnated with an epoxy resin composition compounded with a curing agent and a curing accelerating agent and a copper foil with the untreated surface are lamination-molded on an epoxy resin containing at least 90 pts.wt. of a bromized epoxy resin having two epoxy groups or more in one molecule of 600 to 900 of a mean epoxy equivalent and 15 to 30 wt.% of a brome content in 100 pts.wt. of the gross weight of the epoxy resin and the prepreg, the copper foil and the epoxy resin are integrally formed. By compounding the above bromized epoxy resin into the epoxy resin, the adhesive strength of the epoxy resin to the copper foil can be obtained highly even if the surface of the copper foil is untreated.
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