| 摘要 |
PROBLEM TO BE SOLVED: To improve solder heat resistance, heat shock resistance, moisture resistance reliability, etc., by covering a semiconductor element with an epoxy resin compsn., contg. a compd. shown by a specified formula, a part of or the entire top face of the element having been covered with a polyimide obtd. by dehydrating a polyimide precursor having structural units represented by a specified formula. SOLUTION: A part of or the entire top face of a semiconductor element is covered with a polyimide obtd. by dehydrating a polyimide precursor having structural units as a main component, represented by Formula I (R1 is a trivalent or tetravalent org. group having two C atoms, R2 is a bivalent org. group having two C atoms, and n is 1 or 2). The semiconductor element is further covered with an epoxy resin compsn. which contains an epoxy resin contg. a compd. shown by Formula II (R3-R10 are H atoms, monovalent org. groups or halogen atoms), phenol-based hardening agent, hardening accelerator, inorg. filler, etc.
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