| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for drying a semiconductor wafer for safely and inexpensively drying a semiconductor wafer with high cleanliness, without causing watermarks to be generated. SOLUTION: In a method for drying a semiconductor wafer, desired cleaning of a wafer 2 is conducted, and the wafer is rinsed with pure water. Next, the wafer 2 is impregnated in an HF water solution 1, and the surface of the wafer 2 is replaced with the HF water solution 1. Then, the wafer 2 is pulled up at a speed which is almost 1-2 mm/sec. That is, the wafer 2 is pulled up at a low speed such that water drops are not left on the wafer 2 due to the surface tension of the HF water solution 1.
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