| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and a manufacture thereof that can make the outside dimension yet smaller than conventional ones and at low manufacturing cost. SOLUTION: A wiring board 20, on which wiring pads 23 electrically connected with a plurality of solder balls are formed, is mounted on the pad forming surface having a large number of solder balls at the central part of its upper surface from which copper foil and glass epoxy base material in the periphery on the upper surface side are removed by a cutting machine such as a drill, etc., so that electrode pads 16a are exposed at the central part on the upper surface of a semiconductor element 16, on which a circuit is formed at the central part on the upper surface and a plurality of electrode pads 16a in the periphery are formed. They are electrically connected to each other through bonding with gold wires 18, and then the bonding part is sealed by using a resin 13. |
