发明名称 MANUFACTURE OF MULTI-LAYER COIL SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of a multi-layer coil substrate capable of suppressing the deformation of a conductor pattern coil and a hole for inserting a magnetic core on the multi-layer coil substrate, and manufacturing the multi-layer coil substrate with excellent withstand voltage characteristics by accurate dimensions in a manufacturing process. SOLUTION: This manufacturing method of the multi-layer coil substrate composed by laminating plural green sheets 2 where the conductor pattern coil 4 is formed is provided with a thermocompression bonding process for forming the hole 3 for inserting the magnetic core on the plural green sheets 2, inserting the plural green sheets 2 to a columnar member 8 provided with a cross section for forming a fitting shape with the hole 3, laminating them, clamping the laminated plural green sheets 2 by two pressurizing members 5 and 6, and bonding them in thermocompression.
申请公布号 JP2000068143(A) 申请公布日期 2000.03.03
申请号 JP19980239307 申请日期 1998.08.25
申请人 SHARP CORP 发明人 YAMAGUCHI CHIHIRO
分类号 C04B35/645;H01F17/00;H01F41/04 主分类号 C04B35/645
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