| 摘要 |
PROBLEM TO BE SOLVED: To provide a solid-state image pickup device which assures low manufacturing cost, higher accuracy of positioning for mounting and higher mounting strength. SOLUTION: A solid-state image pickup element package mounting substrate 310 is provided with a mounting pattern 311, provided corresponding to a lead wire 21 of the solid-state image pickup element package an a positioning recognition mark 312 indicating the position of end point of the lead wire 21, when it is loaded and line width of at least a part of the mounting pattern 311 is set identical to that of the lead wire 21. For instance, it is set identical to an end point part 311a of the mounting pattern at the end thereof. The line width of a part 313b other than the end part 311a of the mounting pattern is made thick to improve the mounting strength of the lead wire 21. When the solid-state image pickup element package is mounted, the end part 311a of the mounting pattern is matched with the lead wire 21 in an X-axis direction, while the positioning recognition mark 312 is matched with the end part of lead wire 21 in a Y-axis direction. |
