| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a resistor capable of improving reliability of a soldering portion in being subjected to heat shock and the like by ensuring thickness of solder between a land pattern and the rear electrode layer at 50μm or more, when mounting the resistor on a printed wiring board with the land pattern being reduced. SOLUTION: A resistor comprises a substrate 31, a paired upper electrode layer 32 and rear electrode layer 33 provided on the side of the lower and upper surfaces of the substrate 31, a resistive layer 34 provided so as to be electrically connected to the upper electrode layer 32, a protective layer 35 provided so as to cover at least the upper surface of the resistive layer 34, a side electrode layer 36 without solderability and provided at least on the side of the substrate 31 so as to electrically connect the upper electrode layer 32 to the rear electrode layer 33, and solder layers 37 and 38 provided so as to cover the exposed upper electrode layer 32 and rear electrode layer 33.</p> |
