| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus and method for grinding nitride semiconductor wafers, which particularly prevents chipping, etc., at the rim of a semiconductor wafer and has high yield and excellent productivity. SOLUTION: In an apparatus for grinding wherein nitride semiconductor wafers 102 are placed on the grinding machine of a grinder and ground with a grinding wheel 104, dummy works 101 aside from the nitride semiconductor wafers 102 are provided adjacent to the rims of the nitride semiconductor wafers 102 placed on the grinding machine and ground together with the nitride semiconductor wafers 102, allowing the nitride semiconductor wafers 102 and the grinding wheel 104 to be uniformly pressed and ground. |
