发明名称 FEED THROUGH STRUCTURE OF DISTRIBUTION CONSTANT LINE AND PACKAGE SUBSTRATE USING IT
摘要 PROBLEM TO BE SOLVED: To provide the feed through structure of a distribution constant line which is difficult to generate mismatching. SOLUTION: One end of a first distribution constant line 3 formed on one main surface 2a of a substrate 2 and one end of a second distribution constant line 5 formed on the other main surface 2b of the substrate 2 are connected with each other through a first via hole 7. Then, a first connecting electrode 4 is formed adjacently to one end of the first line 3, a second connecting electrode 6 is formed adjacently to one end of the second line 5 and second via holes 11 and 12 connecting the first and second connecting electrodes 4 and 6 adjacently to the first via hole 7. Thus, mismatching of the whole transmission line including a feed through part can be reduced.
申请公布号 JP2000068713(A) 申请公布日期 2000.03.03
申请号 JP19980234020 申请日期 1998.08.20
申请人 MURATA MFG CO LTD 发明人 HASHIMOTO TAKUYA;SAYANAGI KAZUYA;TANAKA HIROAKI;TAKAI TSUTOMU
分类号 H05K1/02;H01P1/04;H01P3/02;H01P3/08;H01P5/02 主分类号 H05K1/02
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