| 摘要 |
PROBLEM TO BE SOLVED: To surely divide a wafer into chips with exposed trenches serve as markers in dividing the wafer by covering the surface of a wafer with a resin after forming trenches into the wafer, and polishing until the trenches are exposed from the wafer back surface. SOLUTION: The surface of a wafer 10 is sealed with resin, the resin is hardened, and the resin surface is polished to expose posts 4, using a polishing blade. Using a polishing blade 25, the wafer 10 back surface is polished where the polished wafer thickness is about 300-400 μm, for making the chip thickness of a finished device at 200-300 μm. As a result, trenches 22 are fully exposed from the wafer back surface. Electrodes 5 of solder balls, etc., and formed on the surfaces of the exposed posts 4 in this condition. With the trenches 22 exposed on the wafer 10 back surface as markers, the wafer 10 is cut from the back surface, using a diamond blade 26, etc. Thus it can be easily and surely divided into chips. |
