| 摘要 |
PROBLEM TO BE SOLVED: To inspect manufacturing errors generated in functional circuits of an integrated circuit device in various directions with good accuracy. SOLUTION: This integrated circuit device includes a single circuit board 101 of a predetermined shape, various functional circuits formed on a surface of the circuit board 101 by a thin-film technique, an inspection circuit 110 having a plurality of MIS transistors 111 to 114, whose directions of gate electrodes projected from gaps between source and drain regions formed by the thin film technique on the surface of the board 101 are made mutually different. Accordingly, when the function circuits are formed on the surface of the board 101, the inspection circuit 110 is formed at the same time as with this. Since the inspection circuit 110 is made up of the plurality of MIS transistors 111 to 114 whose gate electrode directions are made mutually different, manufacturing errors of the function circuits can be inspected in a plurality of directions. |
