| 摘要 |
PROBLEM TO BE SOLVED: To efficiently remove adhered stain by rotating a wafer having a notch part in a horizontal plane, urging a yarn spreading in a vertical direction to an edge part of the wafer in a tensioning state, urging it to an edge part of the wafer, and cleaning the edge part and the notch part of the wafer. SOLUTION: A wafer 30 is placed on a turn table 10, a yarn 12 spreading in a vertical direction is urged to an edge part 32 of the wafer 30 in a tensioning state, and the table 10 is rotated. Then, the yarn 12 is relatively moved along a circumference of the part 32 of the wafer 30 by rotation of the table 10, intruded into a notch part 34 of the wafer 30, and impurities such as refuse or the like adhered into the part 34 are scraped out by rubbing the yarn 12. Thus, stains adhered to the parts 32 and 34 of the wafer 30 can be efficiently removed.
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