发明名称 HEAT TREATMENT APPARATUS
摘要 PROBLEM TO BE SOLVED: To continuously carry out oxidization, diffusion, and CVD treatments, using one heat treatment apparatus. SOLUTION: A plurality of treating bodies (W) are stored using a holding jig 5 into a reaction tube with an opening 2 on the lower end, a gas inlet opening 3 on a sidewall, and an exhaust opening 4 on the sidewall. The opening 2 on the lower end is covered with a non-metallic cover 6 having heat and corrosion resistances for carrying out a given heat treatment step. A gas introducing system 18 is joined to the gas inlet opening 3 and a pressure-reducible exhaust system 19 is joined to the exhaust opening 4 via a first sealing means 20 having an O-ring which is not exposed to the inside. In addition, a second sealing means 48 other than the O-ring is provided between the opening 2 and the cover body 6.
申请公布号 JP2000068259(A) 申请公布日期 2000.03.03
申请号 JP19980232166 申请日期 1998.08.19
申请人 TOKYO ELECTRON LTD 发明人 SHIMAZU TOMOHISA
分类号 H01L21/22;C23C16/44;C23C16/54;C30B25/08;C30B31/10;F27D99/00;H01L21/205;H01L21/31;H01L21/324;(IPC1-7):H01L21/31 主分类号 H01L21/22
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