| 摘要 |
PROBLEM TO BE SOLVED: To suitably utilize a lead frame, to stably and easily perform manufacture, to improve reliability and to reduce manufacturing cost. SOLUTION: For this package of a semiconductor device, a molded part 12 is provided, an internal lead 10a is fixed, and the mold part 12a on an upper side is formed surrounding a chip loading part 14 and is formed so as to expose a part on one surface side of the inner end part of the internal lead 10a to be a terminal 11 for internal connection which is electrically connected to a semiconductor chip. In this case, at the mold part 12b on a lower side, a hole 22 for exposing a part on the other surface side of the internal lead 10a to be the terminal 13 for external connection is formed, and the outer end part of the internal lead 10a is cut off along the outer shape of the mold part 12. |
