发明名称 DIE BONDER
摘要 PROBLEM TO BE SOLVED: To reduce variations of finishing among substrates which flow to succeeding processes by making the configurations of the substrates equal to each other through bonding of nondefective pellets to the nondefective lands of substrates containing defective lands and defective pellets of the same type to the defective lands as dummies. SOLUTION: Substrates 1 are made to flow after defect marks are put on the defective lands of the substrates 1, and when the substrates 1 reach a bonding position BP, a die bonder discriminates the nondefective/defective states of the lands of the substrates 1 by means of a camera 3, and the nondefective/ defective states of pellets 4 which are successively brought to a pick-up position PP by means of another camera 7. Then the bonder bonds the pellets to the lands of the substrates 1, when both he lands and pellets 4 are nondefective. When the pellets 4 are defective, the bonder picks up the defective pellets and places the picked up pellets 4 on a stocker 9 (however, if the stopper 9 is full with defective pellets, the bonder leaves the pellets 4 as they are). When the lands are defective, in addition, the bonder picks up defective pellets 4a from the stocker 9 and bonds the pellets 4a to the defective lands.
申请公布号 JP2000068296(A) 申请公布日期 2000.03.03
申请号 JP19980232180 申请日期 1998.08.19
申请人 NICHIDEN MACH LTD 发明人 AOKI TORU
分类号 H01L21/52;H01L21/00;(IPC1-7):H01L21/52 主分类号 H01L21/52
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