| 摘要 |
PROBLEM TO BE SOLVED: To prevent connection strength at the time of connecting a metallic case to a substrate from deteriorating, to reduce a connection space with the metallic case on the substrate, and to enlarge a mounting space on the substrate by installing resin between the metallic case and solder in connection parts in an interposition state. SOLUTION: Connection parts 15 are installed in a metallic case 13 and insulating resin 16 is jointed to the inner side of the connection parts 15. Solder 17 is jointed to the inner side of resin 16. On the other hand, a mounting space 18, through holes 19, land patterns 21 and strip lines 22 are formed on a substrate 14. Insulating resin 16 is jointed to the inner side of the connection parts 15 of the land patterns 21 constituting a part of a circuit on the substrate in a plurality of parts of the substrate 14 with the metallic case 13, and they are soldered by given solder 17. The metallic case 13 and the substrate 14 are connected. Thus, the crack of solder 17 or the substrate 14 can be reduced and connection can be improved.
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