| 摘要 |
PROBLEM TO BE SOLVED: To provide a press-contact type semiconductor device, in which uniform contacting states are secured particularly between semiconductor elements and package electrodes and which has reduced heat resistance and electric resistance. SOLUTION: In a press-contact type semiconductor device in whcih a plurality of semiconductor elements 1 is incorporated in a flat package, a conductive nonwoven fabric 6 is put between the semiconductor elements 1 and the electrodes of common electrode plates 4 and 5 or between intermediate electrode plates 2 and 3 which are arranged on each main surface of the elements 1 and the common electrode plates 4 and 5. As a result, the height variation in contacting surfaces can be absorbed sufficiently under relatively low pressure, and heat resistances and electrical resistances at contacting interfaces can be reduced. |
