| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method and means for enabling simple calibration of a wire bonder. SOLUTION: For parameter calibration of a wire bonder 3, a test chip 2 is used together with sensors 5 and 6. The sensors 5 and 6 are built beforehand in the test chip 2. Time passages of signals of the sensors 5 and 6 are detected at a distance from a connection point 4 to a bonding point thereabove, and then subjected to an electronic evaluation for the use of calibration of the wire bonder. The bonder itself can be calibrated with the use of these sensors 5 and 6. Furthermore, in normal operation of the wire bonder 3, the time at which application of ultrasonic waves to a capillary 11 is to be stopped is determined by a time passage of an impedance of an ultrasonic wave transducer which is supplying the capillary 11. |
