| 摘要 |
PROBLEM TO BE SOLVED: To facilitate production of a high density electronic apparatus by forming a pn junction rectifying means and a voltage stabilizing means on a thin isolation film between an integrated circuit board for forming an electronic circuit and a wiring layer thereby incorporating a DC power supply circuit in a semiconductor integrated circuit. SOLUTION: An electronic circuit for supplying an integrated circuit block 2 with DC power produced by rectifying and smoothing power from a commercial power supply applied to input terminals 3', 4' through a rectifying means 1' and a power supply stabilizing means 7 is constituted of a semiconductor integrated circuit. The rectifying means 1' is formed as pn junction diodes 8-11 in a semiconductor region on a silicon oxide film isolating a semiconductor substrate for forming the integrated circuit block 2 from a wiring layer. Similarly the power supply stabilizing means 7 is integrated by an integration process. According to the arrangement, power can be applied directly from a commercial power to the entire integrated circuit.
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