发明名称 MOUNT STRUCTURE FOR IMAGE PICKUP DEVICE
摘要 PROBLEM TO BE SOLVED: To decrease the exterior size of a printed circuit board in a mount structure for an image pickup device which consists of an image pickup element, a lens placed on an optical axis of the image pickup element, and a lens holder holding the lens on the optical axis and where tips of plural lead wires for an image pickup element are soldered to the printed circuit board, while a required mount area is ensured. SOLUTION: A support member 4 is clamped between an image pickup element 1 and a printed circuit board 5. The support member 4 consists of a flat base section 41, that is clamped between a front side of the printed circuit board 5 and a rear side of the image pickup element main body and plural support sections formed to an outer circumference of the base section 41, and the support sections and a lens holder 2 are screw-fastened. A pair of left and right notches 44, with which two both end leads engage among plural leads 11 projected respectively to both sides of the image pickup element main body, are formed to both side faces of the base section 41 of the support member 4.
申请公布号 JP2000069336(A) 申请公布日期 2000.03.03
申请号 JP19980239701 申请日期 1998.08.26
申请人 SANYO ELECTRIC CO LTD;SANYO DENSHI BUHIN KK 发明人 OKUNO HIROKAZU;ADACHI AKIHIRO;ISHIDA MASATOMO;TAKENO MASAHIRO
分类号 H04N5/225;(IPC1-7):H04N5/225 主分类号 H04N5/225
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