| 摘要 |
PROBLEM TO BE SOLVED: To make it possible to ensure easily a full solder wet area for a printed board and a lead. SOLUTION: This soldering method is executed as follows: a solder preform 16 is put at a prescribed position on the side, where is provided with a discrete component, of a printed board 10, a lead 14 is inserted in a through hole 12 to spray a molten solder on the hole 12 from the opposite side to the side, where is provided with the discrete component, of the board and the heat of the molten solder is transferred to the preform 16 to dissolve the preform 16. By the dissolved preform 16, a favorable fillet line is formed on the side, where is provided with the discrete component, of the board. Therefore, a full solder wet area can be easily secured for the board 10 and the lead.
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