| 摘要 |
The invention concerns a method for making a device comprising electronic components (20a, 20b) in regions (32a, 32b) of a semiconductor material layer (12), said regions being mutually insulated. The method is characterised in that it comprises the following steps: a) forming electronic components (30) of the regions of a semiconductor material layer (12) formed by an electrically insulating layer (14); b) forming trenches passing right through the semiconductor material layer (12) so as to separate the regions (32a, 32b); c) filling up the trenches (30) with a fluid filling material; and d) hardening said filling material. The invention is useful for making integrated circuits comprising power components. |
