| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhering method for IC module with which the surface of the module and the surface of a card substrate are pressed while kept parallel by improving a press head and a step between a card and the module is suppressed to a minimum by regulating the amount of push-in. SOLUTION: Concerning this adhering method, an embedding hole (m) for loading an IC module 18 is formed at the prescribed position of a card substrate 15 and after an adhesive agent is applied to the base of this embedding hole, the IC module is fitted into this embedding hole and pressed from the upside by a press head 10. In this case, a frame-shaped projecting part 12 is provided at the central part of this press head and a card press part 11 located at the same height as the frame-shaped projecting part is provided around that projecting part. Then, the IC module 18 is held by the frame-shaped projecting part 12 and pressed. |
