发明名称 POSITIVE PHOTORESIST COMPOSITION
摘要 PROBLEM TO BE SOLVED: To ensure high resolving power and superior dry etching resistance by using a specified resin, a compd. which generates an acid when irradiated with active light or radiation and a solvent. SOLUTION: The positive photoresist compsn. contains (a) a copolymer having structural units of formulae I, II and III, (b) a compd. which generates an acid when irradiated with active light or radiation and (c) a solvent. In the formulae I-III, R1 and R2 may be the same or different and are each H or 1-3C alkyl and X is a divalent org. group. In the formula II, R1' and R2' may be the same or different and are each H or 1-4C alkyl, W is a divalent org. group and R3' is chain alkyl which may have substituents having 11-20 carbon atoms in total, aryl which may have substituents having 11-30 carbon atoms in total, aralkyl which may have substituents having 12-30 carbon atoms in total or the like.
申请公布号 JP2000066400(A) 申请公布日期 2000.03.03
申请号 JP19980234339 申请日期 1998.08.20
申请人 FUJI PHOTO FILM CO LTD 发明人 FUJIMORI TORU;TAN SHIRO
分类号 G03F7/039;H01L21/027 主分类号 G03F7/039
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