发明名称 WAFER INVERTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To obtain a wafer inverting apparatus, which has a simple structure which would form less particles and is easily cleaned. SOLUTION: Movable jaws 11 are each equipped with a disk-shaped body that is constricted near the midpoint along its thickness. A portion of each jaw 11 making contact with the outer periphery of a wafer 20 has a thicknesswise cross section that consists of a V-shaped groove portion 23 which is in the middle, a flange-shaped first projecting portion 21 forming the lateral wall of the lower side of the portion 23 (the attitude prior to inverting the wafer 20), and a flange-shaped second projecting portion 22 forming the lateral wall of the upper side of the portion 23 (the position prior to inverting the wafer 20). Also, the portion 21 extends farther toward the center of the wafer 20 than the portion 22.
申请公布号 JP2000068352(A) 申请公布日期 2000.03.03
申请号 JP19980237259 申请日期 1998.08.24
申请人 TOSHIBA MACH CO LTD 发明人 SUGIYAMA HISATAKA
分类号 B25J15/08;H01L21/304;H01L21/677;H01L21/68;(IPC1-7):H01L21/68 主分类号 B25J15/08
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