| 摘要 |
PROBLEM TO BE SOLVED: To reduce the number of adhesion processes and thereby simplify the assembling process and reduce the processing cost by covering a semiconductor section with resin and, at the same time, providing it with an installation section to install it on a base. SOLUTION: G sensor 20 is mounted near the center of the surface of a ceramic substrate 1. One of the sides of the quadrangle of the ceramic substrate 1 is formed with a plurality of leads 4 crossing at right angles with this side. A cover frame 3 for the G sensor 20 is bonded by the bottom perimeter to the ceramic substrate 1 with a silicon adhesive 51. Then, a semiconductor section 5 which is the ceramic substrate 1 combined with the cover frame 3 is covered with thermosetting resin 50 to keep a semiconductor device 7 in an airtight state. Moreover, installation holes 6 for installing the semiconductor device 7 on a base with small screws are formed with the same material. As a result, the processing cost can be reduced and the durability of a semiconductor can be increased. |
