| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of mounting an electronic part on a bord, wherein an assembly process can be easily automated without increasing a material cost remarkably, and a circuit board superior in heat dissipating than a printed board can be used. SOLUTION: This mounting method comprises a first step S1 where a circuit patterns are formed on a conductive metal belt by blanking, a third step S3 where a synthetic resin base is formed on the conductive metal belt at the same time keeping electrodes where a surface mounting electronic parts are soldered exposed, a fourth step S4 where the metal belt is rolled on a reel and then cut into pieces that are each provided with unit circuit patterns, and a fifth step S5, where electronic parts are each mounted on the circuit patterns. |
