发明名称 COMPONENT MOUNTING METHOD AND APPARATUS
摘要 PROBLEM TO BE SOLVED: To enable mounting of a component in a short time with less heat consumption, with a simple facility, while realizing a sufficient electrical joint between the part and an object to be mounted. SOLUTION: When an electrical joint 5 of a component 3 is pressure contacted with an electrical joint 6 of an object 4 to be mounted, the component 3 is moved closer to the object 4 while pushing a previously provided sealing material 11 against one or both of these joints and to fill the material in a necessary range therebetween. At the same time, by applying ultrasonic vibration to the part 3, friction is caused between the joint 5 of the part 3 and the joint 6 of the object 4 in a mutually compressed state therebetween thereby both the joints 5 and 6 are ultrasonically bonded to each other, and the part 3 is mounted onto the object 4.
申请公布号 JP2000068327(A) 申请公布日期 2000.03.03
申请号 JP19980233875 申请日期 1998.08.20
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 AZUMA KAZUJI;OTANI HIROYUKI;MINAMITANI SHOZO;KANAYAMA SHINJI;TAKAHASHI KENJI
分类号 H01L21/60;B23K20/10;H01L21/56;H01L21/607 主分类号 H01L21/60
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