| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for freely setting the correction quantity of a lead and accurately uniforming the dispersion of lead forms different in various rods at the time of lead bend working into a prescribed form. SOLUTION: In the lead correction method of a semiconductor package, a mold device for lead correction, which contains a lower mold K2 on which the semiconductor package 1, is loaded and an upper mold K1 depressing the semiconductor package 1, is used at bend-forming of a lead L part of the semiconductor package 1, whose lead work terminates and correcting it into a prescribed form. A method for executing a first bend work process which bends the lead part upward and a second bend process which bends the lead part downward after the first bend process is adopted.
|
