发明名称 METHOD FOR MACHINING CIRCUIT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To increase insulation resistance between electrodes and decrease an effective dielectric constant by irradiating a conductor material provided on a substrate with light beams to form the conductor material into a predetermined circuit pattern and at the same time by machining a groove with a predetermined depth between circuit patterns of the substrate. SOLUTION: After a conductor material 2 is provided on a substrate 1, the conductor material 2 and the substrate 1 are irradiated with a light beam 3 to make a predetermined pattern on the conductor material 2 and at the same time to form a groove 4 with a predetermined depth between circuit patterns of the substrate 1. Since the circuit pattern and the groove are made simultaneously by the light beam, a fine circuit pattern which is free from blurs and scratches and which is excellent in machined shapes of the circuit pattern and the groove 4 can be formed. Even if the circuit pattern is extremely fine, the groove with a predetermined depth formed between the circuit patterns can improve insulation resistance between circuits and prevents electrodes from short-circuiting, thereby decreasing an effective dielectric constant between the electrodes.
申请公布号 JP2000068625(A) 申请公布日期 2000.03.03
申请号 JP19980240313 申请日期 1998.08.26
申请人 MURATA MFG CO LTD 发明人 BANDAI HARUFUMI;SUESADA TAKESHI
分类号 H05K3/08;H01L23/13;H05K3/00;(IPC1-7):H05K3/08 主分类号 H05K3/08
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