| 摘要 |
PROBLEM TO BE SOLVED: To enable making into multiple-pin constitution and superior compatibility that can switch types of chips as well as achieve a package of the minimal size, when a memory or a memory logic mixed chip is packaged in a CSP structure. SOLUTION: This device is provided with a semiconductor chip 11, having electrode pads 12, an electrode pad forming surface 11a fastened to the element mounting surface via an adhesive, external terminals (ball bumps 15) for external connection provided on the surface opposite to the element mounting surface and a base substrate 13 with multilayered wiring, on which wiring conductors 16, 17, 18 connected to each external terminal are formed. At a position corresponding to the electrode pad on the semiconductor element side of the substrate, a slit 25 is drilled so that at least one electrode pad is exposed and the wiring conductor and the electrode pad on the chip side are connected by the bonding wire 26 through the slit. |
