发明名称 |
Halbleiterbeschleunigungssensor |
摘要 |
<p>The sensor has a sensor chip (1) fastened to a base (13) in a cantilevered manner. A set of measuring resistors (1b) is arranged on the surface of the sensor chip to form a bridge circuit. A membrane part (1a) is formed on the reverse of the measuring resistors. An aluminium electrode (2) is arranged on the front of the free end of the chip orientated in the longitudinal axis of the chip. Preferably, the sensor has bonding electrodes (4a) formed on the front surface of the chip and an aluminium wiring pattern extending over the membrane region and along the outside of the free end of the chip. The aluminium wiring (4b), the bonding electrodes and the aluminium electrode are all electrically connected together.</p> |
申请公布号 |
DE19523171(C2) |
申请公布日期 |
2000.03.02 |
申请号 |
DE1995123171 |
申请日期 |
1995.06.26 |
申请人 |
MITSUBISHI DENKI K.K., TOKIO/TOKYO |
发明人 |
KATO, HAZIME |
分类号 |
G01P15/12;G01P21/00;H01L29/84;(IPC1-7):G01P15/12;H01L21/66;H01L23/48 |
主分类号 |
G01P15/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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