| 摘要 |
<p>Purpose: a method and a device for distributing solder balls which completely prevent missing or duplicated solder balls. Constitution: a storing hole (11) sized for allowing only one solder ball (4) to be stored therein is provided in an aligning plate (10) at a position to which the solder ball (4) is to be distributed on a printed wiring board (5). Solder balls are supplied to the aligning plate (10) to allow each storing hole (11) to receive one each solder ball (4) and then the plate (10) is inclined to remove surplus solder balls (4). Next, a suction head (20) having suction ports (21) at the same positions as those of the storing holes (11) and having no missing nor duplicated solder balls (4) sucks the solder balls (4), which are then transported to immediately above the printed wiring board (5) and released from the suction, whereby the solder balls (4) are distributed to the board (5).</p> |
