METHOD FOR PRODUCING INTEGRATED SWITCHING CIRCUITS AND SEMICONDUCTOR WAFER COMPRISING INTEGRATED SWITCHING CIRCUITS

摘要

The invention relates to a method for producing integrated switching circuits. A semiconductor wafer (20) exhibits an active surface with circuit structures. An electrically isolating intermediate layer (22) and an electrically conductive sheet are applied onto said active surface. Printed conductors (9) with connection balls are formed on said conductive sheet in a relatively coarse grid. Said semiconductor wafer (20) is then divided into integrated circuits.