发明名称 |
Silicon alloys for electronic packaging |
摘要 |
<p>A method of producing a silicon based alloy is described which comprises melting a silicon alloy containing greater than 50 wt. % silicon and preferably including aluminium. The melted alloy is then inert gas atomized to produce powder or a spray formed deposit in which the silicon forms a substantially continuous phase made up of fine, randomly oriented crystals in the microstructure. The alloy produced by the method has particularly useful application in electronics packaging materials and a typical example comprises an alloy of 70 wt. % silicon and 30 wt. % aluminium. Such an alloy is an engineering material which, for example, is machinable.</p> |
申请公布号 |
GB2317900(B) |
申请公布日期 |
2000.03.01 |
申请号 |
GB19980000723 |
申请日期 |
1996.07.18 |
申请人 |
* OSPREY METALS LIMITED |
发明人 |
ALAN GEORGE * LEATHAM;ANDREW JOSEF WIDAWSKI * OGILVY;LUIS * ELIAS |
分类号 |
B22D23/00;B22F3/115;B22F9/08;C22C1/04;C22C1/10;C22C25/00;C22C28/00;C22C32/00;H01L23/06;H01L23/14;H01L23/373;(IPC1-7):B22D23/00;H01L23/36 |
主分类号 |
B22D23/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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