| 摘要 |
PROBLEM TO BE SOLVED: To make uniform an adhesive layer by bonding a piezoelectric element and a ceramic substrate through a conductive adhesive, arranging a support material on the opposite sides of the piezoelectric element on the ceramic substrate and then bonding the support material to the nonadhesive part of the conductive adhesive. SOLUTION: In order to prevent bonding strength from lowering due to adhesion of a foreign matter to a piezoelectric element 2 fixed to a ceramic substrate 1 or the electrode part of the ceramic substrate 1, ultrasonic cleaning is performed using an organic solvent followed by plasma processing. Conductive adhesive 3 is applied uniformly to couple the ceramic substrate 1 and the piezoelectric element 2 which is then pressed onto the ceramic substrate 1 and bonded thereto such that the conductive adhesive 3 projects from the opposite sides. Subsequently, a rectangular prism support material 5 is applied to the projecting part of the conductive adhesive 3 and thermally set while being pressed. According to the method, adhesive layer of the piezoelectric element 2 and the ceramic substrate 1 can be made uniform.
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