发明名称 SEALING INJECTION MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a sealing injection molding device in which injection molding and sealing molding are not separately performed, low pressure injection is enabled, miniaturization is contrived, installation area is small, and cost reduction of a molding machine is contrived. SOLUTION: In the sealing injection molding device 20, a turning means 25, a vertically moving means 25A and spirally moving means 25B are provided respectively in an axis connected to the body of an agitating injection plunger of an injection part 21. Furthermore an injection cylinder 23 is formed into cylindrical slenderness and a heater of the injection part is fitted so as to surround the injection cylinder, The injection part 21 in which the agitating injection plunger is inserted into the injection cylinder 23, is incorporated into a mold 40 which is fitted between a fixed plate 20A and a moving plate 20B, so as to be directly joined.
申请公布号 JP2000061977(A) 申请公布日期 2000.02.29
申请号 JP19980237378 申请日期 1998.08.24
申请人 TSUKUBA SEIKO KK 发明人 IIDA ISAO;HIROSE YOSHITAKA
分类号 B29C45/02;B29C45/14;B29C45/18;B29C45/53;B29C45/74;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/02
代理机构 代理人
主权项
地址