发明名称 FLOOR HEAT-INSULATING STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide floor heat-insulating structure, in which a heat-insulating material can be installed even when the thickness of the heat-insulating material must be formed in thickness larger than the height of a floor joist. SOLUTION: A plurality of beams 2 are juxtaposed at intervals, a heat- insulating material receiving sheet 71 is arranged onto the beams 2, a plurality of floor joists are disposed in an array at intervals while being crossed with the beams 2 on the sheet 71, and heat-insulating materials 7, 7A are installed among the floor joists on the heat-insulating material receiving sheet 71 in floor heat-insulating structure. The heat-insulating material receiving sheet 71 has liquid permeability and rod-shaped materials 711 are mounted at both end sections of the sheet 71 at that time, the heat-insulating materials 7, 7A set up among the beams 2 are mounted integrally onto the underside of the sheet 71, and the rod-shaped materials 711 are fitted and attached to rod-shaped material fitting sections 721, 731 installed to the beams 2.
申请公布号 JP2000064577(A) 申请公布日期 2000.02.29
申请号 JP19980235894 申请日期 1998.08.21
申请人 SEKISUI CHEM CO LTD 发明人 ETSUNO MASAYUKI
分类号 E04F15/00;E04F15/18;(IPC1-7):E04F15/18 主分类号 E04F15/00
代理机构 代理人
主权项
地址