发明名称 THERMAL TRANSFER FILM
摘要 PROBLEM TO BE SOLVED: To provide a thermal transfer film without lowering an adhesive strength of a transferred design by transferring the design to an article having a surface misalignment of a protrusion and recess pattern, embossing, a stepwise difference or the like. SOLUTION: The thermal transfer film comprises a support film having a base film 1 and a film 2 made of different type resin formed on the film 1, a release layer 3 formed on the different type resin side surface of the support film, a design layer 4 formed on the layer 3, and an adhesive layer 5 formed to cover the layer 3 and the layer 4.
申请公布号 JP2000062396(A) 申请公布日期 2000.02.29
申请号 JP19980230674 申请日期 1998.08.17
申请人 ROYAL KOGYO KK 发明人 INUI TETSUO;MATSUDA YUKIO;SANO TAIJI;KIRITANI KOJI
分类号 B44C1/17;(IPC1-7):B44C1/17 主分类号 B44C1/17
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