| 摘要 |
PROBLEM TO BE SOLVED: To reduce the deviation in each component at each position of a solder ingot and to restrain the development of shrinkage cavity by melting a material consisting essentially of anyone of Pb, Sn and In and containing adding component having a specific m.p., at the temp. having higher than the liquidus in this composition by a speicific temp. and rapidly cooling at a specific cooling speed. SOLUTION: The solder material consisting essentially of anyone of Pb, Sn and In and containing high m.p. component having 1000-3000 deg.C m.p., is cast. The solder material is melted at the higher temp. than the liquidus in this composition by 200-1300 deg.C and poured into a mold and rapidly cooled at >=20 deg.C/sec cooling speed. It is desirable that the content of anyone of Pb, Sn and In is >=60%, and further, desirable that this content is >=90%. The high m.p. component is desirable to be Fe, Ni, Pd and Cd. It is desirable that the content of the high m.p. component is 0.01-3 wt.%. The melting of the solder material is desirable to execute in non-oxidizing atmosphere of Ar, N2, etc.
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