| 摘要 |
PROBLEM TO BE SOLVED: To obtain a pressure-sensitive adhesive sheet suitable for a process by which an extremely thin chip is produced in good yield by forming a film having many fine notches and different in shrinkage, on a film and further forming a pressure-sensitive adhesive layer thereon. SOLUTION: This pressure-sensitive adhesive sheet is obtained by forming a pressure-sensitive adhesive layer 4 on a substrate 1 composed of a first film 2 and an elastic second film 3 having many fine notches 5 formed therein. The first film 2 is preferably a nonshrinkable film [having <10% shrinkage of the equation 100×(the size before the shrinkage-the size after the shrinkage)/(the size before the shrinkage)] having 5-300μm thickness, e.g. a polyethylene film and a polypropylene film. The second film 3 is preferably a heat-shrinkable film, preferably having 10-90% shrinkage, and having 5-300μm thickness, preferably a biaxially oriented film or the like such as polyethylene terephthalate and polystyrene films. The notches 5 are preferably formed so as to extend to the nearly whole thickness.
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