| 摘要 |
PROBLEM TO BE SOLVED: To provide semiconductor sealing epoxy resin compositions excellent in high temperature storage properties and soldering crack resistance and, at the same time, excellent in the balance of high temperature storage properties and flame retardance. SOLUTION: This epoxy resin composition comprises an epoxy resin, a phenolic resin, 0.1-10 wt.%, based on the total epoxy resin composition, a compound having an effective pore diameter of 6Åor more and represented by the formula: XM2/nO.Al2O3⊗YSiO2⊗ZH2O (wherein X is 0.1-2.0; Y is 1.0-200; Z is 0-100; M is an alkali metal or an alkaline earth metal; and (n) is the valence of M), an inorganic filler, a hardening accelerator, 0.1-5 wt.%, based on the total epoxy resin composition, diantimony tetraoxide and/or diantimony pentaoxide and brominated epoxy resin as the essential components.
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