| 摘要 |
PROBLEM TO BE SOLVED: To obtain a resin composition which, when used to seal a wafer state semiconductor element, can give a sealed semiconductor element having improved reliability in a low fraction defective by mixing a filler having a specified or lower maximum particle diameter with an epoxy resin and a curing agent. SOLUTION: The filler used is one having a maximum particle diameter of 45μm or below. It is exemplified by calcium carbonate or titanium oxide, especially, amorphous fused silica, for example, fused silica produced by fusing quarts or a synthetic silica and is desirably spherical. The epoxy resin used is any one that has at least two epoxy groups in the molecule and is exemplified by a bisphenol F epoxy resin or a naphthalene-skeleton-containing epoxy resin. The curing agent used is a phenolic resin derivative having at least two phenolic hydroxyl groups, a polyamine derivative or the like. When the composition is used in producing a chip-size semiconductor device by a process comprising sealing in a wafer state and cutting the sealed wafer, the moldability is improved, and the break of the bump of an electrode can be decreased.
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