发明名称 FOAM MOLDING DEVICE
摘要 PROBLEM TO BE SOLVED: To realize the low cost mold cost of a foam molding device, easy and quick removing work of self-sealed foam tailings, saving of man power and easy and quick application work of a releasant, reduction of the usage of the releasant and improvement of yield of the device. SOLUTION: A plurality of bottom molds 12A of a foam mold 11 are provided to one top mold 13 for commonly using for a plurality of the bottom molds 12A and 12B. The top mold 13 has a ;pair of molding surfaces 15 and 16 respectively on one side and on the other side of it. The molding surfaces 15 and 16 are formed in corresponding respectively to a plurality of the bottom molds 12A and 12B. In the top mold 13, vent holes 31 and 32 are formed so as to pass through a pair of the molding surfaces 15 and 16.
申请公布号 JP2000061946(A) 申请公布日期 2000.02.29
申请号 JP19980253253 申请日期 1998.08.24
申请人 IKEDA BUSSAN CO LTD 发明人 YAGISHITA NORIO
分类号 B29C33/10;B29C39/26;B29C67/20;B29K105/04;(IPC1-7):B29C33/10 主分类号 B29C33/10
代理机构 代理人
主权项
地址